Thermal
Interface Materials
Mastering Heat
With Nano-Materials
Applications

Consumer
Electronics

Power
Supplies

Automotive
Electronics

LED, LCD and
Optical Displays

Motor
Controls

High Power Density
Semiconductors

Batteries and Energy
Storage Devices
About
Thermexit Pads
Nanoramic Thermexit™ is a line of high-end thermal interface gap filler pads. Nanoramic's® gap fillers are a non-reactive, non-silicon, no cure system featuring high thermal conductivity and high thermal stability. Nanoramic® produces 2 novel product lines, a
High Performance
TIM Gap Filler and an
Electrically Insulating
TIM Gap Filler.
The Nanoramic Thermexit™ technology is derived from years of government funded research and development in advanced materials including the application of carbon nanotubes in electrochemical systems as well as dispersion, compounding and coating process for composites of nanotubes and other carbons. Based on a deep knowledge of nanocarbon materials, processes, and applications, Nanoramic® has demonstrated success in polymer-based composites, thermal interface materials, and binderless electrodes for energy storage.
Product Lines
High Performance
TIM Pad
KEY FEATURES
Electrically Insulating
TIM Pad

KEY FEATURES
Government Awards



Investors

