Mastering Heat
With Nano-Materials
Nanoramic Thermexit™ is a line of high-end thermal interface gap filler pads. Nanoramic's® gap fillers are a non-reactive, non-silicon, no cure system featuring high thermal conductivity and high thermal stability. Nanoramic® produces 2 novel product lines, a High Performance TIM Gap Filler and an Electrically Insulating TIM Gap Filler.
The Nanoramic Thermexit™ technology is derived from years of government funded research and development in advanced materials including the application of carbon nanotubes in electrochemical systems as well as dispersion, compounding and coating process for composites of nanotubes and other carbons. Based on a deep knowledge of nanocarbon materials, processes, and applications, Nanoramic® has demonstrated success in polymer-based composites, thermal interface materials, and binderless electrodes for energy storage.
Non-silicone, non-reactive, no-cure system (no resin-filler separation or unconsumed reactant outgassing)
High thermal stability, with continuous operation over 150°C
High thermal conductivity (>40W/mK)
Easy pick and place application (naturally sticky) without residue/mess
Highly compressible to minimize contact resistance without high force and component stress
download datasheetNon-silicone, non-reactive, no-cure system (no resin-filler separation or unconsumed reactant outgassing)
High thermal stability, with continuous operation over 150°C
High thermal conductivity (>20W/mK)
Easy pick and place application (naturally sticky) without residue/mess
Highly compressible to minimize contact resistance without high force and component stress
High breakdown voltage
download datasheet
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