Thermexit Blog

February 5, 2020

Author: Jess Sudak

Why Modern Gap-Filler Pads Perform Better Than Other Thermal Interface Materials (TIMs) in Electronic Components

As engineers prioritize both reducing the size and increasing the power of computing devices, improving how we manage their thermal output becomes increasingly important. Overheating remains one of the leading causes of electronic product failure — 55% of failures occur in this way, Electronics360 reports.

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