High Performance TIM Pad

Key Features
Non-Silicone, non-reactive, no-cure system (no resin-filler separation or unconsumed reactant outgassing)
High thermal stability, with continuous operation over 150°C
High thermal conductivity (>30W/mK)
Easy pick and place application (naturally sticky) without residue/mess
Highly compressible to minimize contact resistance without high force and component stress
Market Applications
Consumer electronics
Power supplies
Automotive electronics
LED, LCD and optical display
Motor controls
High power density semiconductors
Batteries or energy storage devices